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The model SV300 was specially developed for the IGBT power module precise die bonding of multiple components assembly with high efficiency. These models are equipped with high precise driving systems and powerful software functions, the feeding system is compatible with Auto-Tray and Tape feeder types of materials supplied in one machine, it can flexibly meet the requirements of IGBT multiple chips (dies) bonding simultaneous.

IGBT power die bond

The models SV300 was equipped with high precise driving systems and multiple feeding systems, it can flexibly meet the requirements of IGBT multiple chips (dies) bonding simultaneous.

4 bonding heads

SV300 was adopted 4 bond heads helps to increase the production efficiency and provides more favorable conditions for pick up multiple types or more materials at each placement cycle.

2 x Auto-Tray system

SV300 was adopted two sets of Auto-tray system, the capacity of each auto-tray cabinet is max. 8 tray cassettes. Tray cassettes capacity max. 120x250mm or 120x120mm x 2 trays (component height max. 10mm), compatible max. 10 types of components (tray forms) of bonding simultaneous

Tape feeder platform

Up to 8 Tape Feeders or two set of Solder-plate tape feeders, compatible the HT2-14 / HT12-26 / HT22-36 types of Solder-plate feeder (for solder-plate size: 2x2~14x14mm / 12x12~26x26mm / 22x22~36x36mm)